ETF Department at STARC is engaged in integration and testing of MEMS devices which include Pressure Transducer, Accelerometer, G-switch, Load switch, Vibration sensor, Acoustic Sensor and other MEMS devices. The Department is equipped with state of the art test facilities which include best in class Pressure and Temperature Calibration Systems, Thermal Chambers, Thermal Shock Chambers, Climatic Chambers, Shaker and Mechanical Shock System capable of performing the tests as per MIL specification and customer specific test requirements. Various MEMS devices have been screened and qualified to MIL standards as per Customer specifications using the test facilities.
It is a 80 litre capacity thermal chamber with an operating range of -40 deg. C to +160 deg. C. It is used for calibration of small batches of sensors. It makes calibration very quick due to its small size and excellent temperature uniformity and accuracy.
It is a 300 liter capacity Thermal chamber with Humidity Control. It has an operating range of -70 deg. C to +180 deg. C and 20% to 97% RH. It is used for calibration as well as performing Acceptance & Qualification Testing of sensors.
It is a 300 liter capacity Thermal chamber with Humidity Control. It has an operating range of -70 deg. C to +180 deg. C and 20% to 97% RH. It is used for performing Acceptance & Qualification Testing of sensors which require high temperature ramp rates.
It is a 300 liter capacity Thermal shock chamber. It has two compartments, the hot chamber has a range of +25 deg. C to +215 deg. C and the cold chamber has an operating range of -70 deg. C to +180 deg. C. It is used for performing Qualification Testing of sensors.
It is a comprehensive Test Bench comprising high precision Hydraulic and Pneumatic Pressure Calibrators, Data Acquisition systems and stable power supply units. It is useful for calibration of Pressure measuring devices for a wide pressure range from 0-1200 bar, with high accuracy.
It is capable of producing 3-6 bumps/second. This equipment is useful for performing bump test on various MEMS devices.
It is an automatic Video Measurement system for performing complex dimensional measurements on manufactured parts, PCBs etc., with an accuracy of 0.1 micron. It can perform pre-programmed measurements using non-contact as well as contact based techniques, within seconds.
It is an integrated Vibration and Thermal chamber for in-situ vibration and temperature tests. It is useful for performing Environmental stress screening and accelerated life tests.